AGY has partnered with JPS Composite Materials to manufacture the first North American-based low coefficient of thermal expansion (CTE) glass fibre fabric developed specifically for advanced integrated circuit substrates and next-generation semiconductor packaging technologies.

Under the agreement, JPS Composite Materials will weave the new substrate fabrics at its facility in Statesville, North Carolina, using AGY’s proprietary L-HDI ultra-low CTE glass fibre. The fibre is produced at AGY’s manufacturing site in Aiken, South Carolina. Together, the companies are creating a fully domestic supply chain for essential reinforcement materials used in high-performance semiconductor applications.

“Establishing a North American source for low CTE glass fibre fabric is a major milestone for the semiconductor supply chain,” said Patrick Hunter, CCO and President at AGY. “Our L-HDI glass fibre platform was developed to meet the growing demands for dimensional stability and dielectric performance in next-generation IC substrates. By working with JPS, we are providing a domestic solution that strengthens supply chain resilience while supporting innovation in advanced packaging.”

AGY’s L-HDI glass fibre is engineered to deliver ultra-low CTE, strong dielectric performance and consistent filament structure required for advanced electronic laminates and substrates. JPS contributes decades of expertise in precision weaving and high-performance fabric production, ensuring the strict construction control and quality standards needed for semiconductor-grade materials.